Wafer dicing is probably the processes popular in the semiconductor industry. It is a method of separating a die from the wafer of semiconductor which is accomplished using several methods like scribing and breaking, by mechanical sawing, or by laser cutting. Using wafer dicing machine, wafers are cut into individual semiconductor chips, by using dicing blades.
‘Wafer dicing methods’
Scribing and breaking – usually is done in a substrate made of a brittle material by which good-quality cutting surface of the substrate may be accomplished without any defects such as chippings on the substrate. This method of semiconductor wafer separation is achieved by developing a stress in the wafer and fracturing the wafer along the stress line. A line must be created in the wafer surface along the street where in fact the break is desired.
Mechanical sawing – the procedure is done using a mechanical machine called dicing saw; this method is used for a micro electro-mechanical system semiconductor devices. While there are still manufacturers that utilize this method, it is slowly getting unpopular due to several disadvantages – the procedure is slow, contaminant-laden, and influenced by regular shapes.
Laser cutting – a new and much more effective technology to cut semiconductor materials; the process functions by directing the output of a high-power laser at the material to be cut. This process burns or vaporizes away the unwanted parts, leaving an advantage with a high-quality surface finish.
As mentioned above, dicing blades are used and are a significant element for the dicing process. There are many types of dicing blades plus some of them will be the following:
Hubbed Nickel Bonded Blades – that is used to cut Silicon and III-V materials. This blade is ultra-thin and created using a special electrodepositing strategy to contain the cutting diamonds in a nickel alloy matrix.
Hubbed Resin Bonded Blades – with this particular type of blade, there is no need to buy expensive flanges as the resinoid blade is permanently mounted to its hub. As opposed to flanges, once the blade is dressed, it usually is detached and reattached again without going through the dressing process.
Hubless Resin Bonden Blades – this kind of dicing blade performs extremely well on materials like ceramic, quartz, sapphire and glass. yoursite.com can give minimum chipping and superior finish.
Metal Sintered Dicing Blades – this is a type of blade that is developed by capturing diamonds in a metal binder using sintering process – this is the very rigid blade and contains an extremely low wear rates. These properties offer the capability to create very straight cuts even when subjected to large exposures.